Talk to an expert about IC Packaging design and verification

Want to learn more about IC Packaging? The IC Packaging Design and Verification integrated flow addresses prototyping challenges to signoff for FOWLP, 2.5/3D IC, and other emerging integration technologies.

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Xpedition IC Packaging

Xpedition IC Packaging Design tools provide a complete design solution for creating complex, multi-die homogeneous or heterogeneous devices using FOWLP, 2.5/3D, or system-in-package (SiP) modules, as well as IC package assembly prototyping, planning, co-design, and substrate layout implementation. Learn more about Xpedition IC Packaging