Innovator3D IC design
Unified chiplet, interposer, and package design and implementation
As the integration of hundreds of chiplets and millions of interconnects into a single package introduces exponentially growing multiphysics and reliability risks, Siemens EDA offers a comprehensive 3D IC design flow designed to manage these complexities.
Our solution, centered around the AI-powered Innovator3D IC Integrator, streamlines the development of heterogeneous integrations by connecting planning, design, integration, and signoff within a unified digital twin. This platform facilitates collaborative co-design of chiplets, photonics, and advanced packages, featuring automated routing, multiphysics analysis, hierarchical design, and advanced physical verification with tools like Calibre. By automating bump assignments, verifying alignment, and mapping micro-bumps, Siemens ensures manufacturable designs and correct connectivity while maintaining design consistency and multi-domain traceability through a native LEF/DEF ECO flow. This approach accelerates 3D design and implementation, allowing for the mixing and matching of specialized components, diverse technology nodes, and various foundries to optimize cost, yield, and overall system performance.