As AI power densities rise, liquid cooling is becoming essential for AI-ready data centers. For OEMs developing cooling infrastructure, this introduces new challenges in liquid cooling system design, integration and commissioning. This session, hosted by Data Centre Dynamics, explores where liquid cooling deployments encounter risk and why strong engineering capability is critical. Experts discuss how manufacturers can address these challenges through scalable cooling controls, intelligent hydronic components and early design validation using physics-based simulation to reduce deployment risk and accelerate delivery of data centers.
This webinar is designed for cooling equipment manufacturers (OEMs), system architects and engineering teams developing liquid cooling solutions for AI-ready data centers.
James Raddings
Digital Portfolio Lead, DatacenterDynamics (DCD)
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Chris Stocker
OEM Data Center Lead - US, Siemens
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Jaskeerat (Joji) Singh
Senior Product Manager, Nortek Data Center Cooling
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Dr Ramsatish Kaluri
Head of Research Group Simulation and Digital Twin Technology, Siemens
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