3D IC enables designers to partition a design and integrate silicon IP at the most appropriate process node and process – leading to lower manufacturing costs, higher wafer yields, lower power consumption and overall lower costs.
View this introductory infographic to learn how to unlock the potential of 3D IC.
Lead the way in 3D IC design with four enabling approaches
Transition from design-based to systems-based optimization
Expand the supply chain and tool ecosystem
Balance design resources across competing multi-domain requirements
Engineer a smarter future faster with Siemens 3D IC workflows
The Siemens 3D IC heterogeneous semiconductor packaging workflows catapult design teams into the future of IC design today.