Talk To An Expert About IC Packaging!

Your competition is completing package designs 30% faster— because they have begun using Xpedition Package Designer (xPD). Let our experts show you how xPD’s advanced features can reduce your design times while ensuring manufacturability and performance.

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Cut your design times by 30%

xPD is designed for the physical design, verification, and modeling of emerging High Density Advanced Packaging (HDAP) technologies. If you would like to learn more we invite you to explore the overview video, white papers, and how-to videos on this resource page. Check it out!