Skip to Main Content
Fact Sheet

Tessent Multi-Die software for 2.5D and 3D IC designs

Siemens EDA’s expansion in automation for 3D ICs

Designing dies for a 3D stacked architecture must incorporate relevant standards so they can be efficiently integrated and packaged. The Tessent Multi-die software from Siemens EDA enables automation and support for the generation and insertion of hardware that is compliant with the IEEE 1838 standard, defining the IEEE test access architecture for 3D stacked ICs utilizing the IEEE 1687 standard.

Solving complex 3D die stacking challenges

The demand for smaller, higher-performing and more power-efficient integrated circuits (ICs) continues. Next-generation devices often feature complex 2.5D and 3D architectures that connect dies vertically (3D IC) or side-by-side (2.5D). 3D die stacking highlights challenges for IC test with legacy approaches built using conventional two-dimensional processes. Siemens EDA’s Tessent Multi-die software solves complex 3D die stacking challenges with a comprehensive DFT automation solution for highly complex tasks associated with 2.5D and 3D IC designs. Learn more about Tessent Multi-die software in this fact sheet.