fact sheet

Solido FastSPICE

Accelerated FastSPICE simulation for SoC and memory designs

Reading time: 5 minutes
Integrated circuit on a blue hued printed circuit board with traces in orange, white and red on the PCB

Modern trends in chip designs, propelled by advancements such as advanced node adoptions and “More than Moore” designs, have significantly increased design complexity. As analog and custom IC designers strive to meet these demands, they encounter formidable obstacles in the form of slow and lengthy simulations that often fail to adequately cover all aspects of verification. The Siemens EDA Solido FastSPICE simulator uniquely delivers.

Solido™ FastSPICE, with multi-resolution technology, is a next-generation fast SPICE simulation tool with scalable accuracy for analog and mixed-signal transistor-level functional verification and memory/analog characterization. It features a unified model for SPICE and Fast SPICE scaling, tunable partitioning, topology/circuit-based detection, multi-rate simulation, table-based device modeling, measurement aware simulation technology, and advanced parasitic reduction modes for the highest performance.

The combined technologies provide circuit designers with a unified simulation interface to achieve simulation results order-of-magnitude faster than traditional SPICE simulation with predictable accuracy. Solido FastSPICE supports industry-standard netlist formats and is integrated into the Symphony™ mixed-signal simulation solution, supporting full-chip SoC verification.

Share

Related resources

Design optimal ESD protection using context-aware SPICE simulation
Technical Paper

Design optimal ESD protection using context-aware SPICE simulation

Electrostatic discharge (ESD) is a major concern for IC reliability, but how do you avoid overdesign of ESD protection when pushing the boundaries of power, performance and area targets?

A new era of EDA powered by AI
White Paper

A new era of EDA powered by AI

For decades, Siemens has been deploying AI, at-scale, for IC design and manufacturing to help customers deliver better products. This white paper reviews the development of our EDA software with AI with examples.

Shift left with Calibre 3DThermal
Video

Shift left with Calibre 3DThermal

Perform thermal analysis for 2.5D and 3DI Cs throughout the IP, chip/chiplet and internal package design cycle to improve thermal robustness and design reliability.