Calibre 3DStress

Calibre 3DStress brings advanced, Calibre-accurate stress simulation to the heart of the 3D IC design flow. By enabling die-level and chip-package co-design analysis early in the process, it empowers engineers to optimize IC layout, chiplet placement and packaging decisions before fabrication even begins. The solution’s native solver engine and integrated visualization deliver actionable insights down to the transistor level—helping teams meet demanding reliability and performance requirements for heterogeneous 3D designs. Built on the trusted Calibre platform, Calibre 3DStress streamlines sign-off, reduces design risk and improves efficiency for today’s most complex semiconductor projects.