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fact sheet

Calibre 3DSTACK

3D-IC verification

The Calibre 3DSTACK tool extends Calibre die-level signoff verification to enable complete signoff verification of a wide variety of 2.5D and 3D stacked die assemblies. With Calibre 3DSTACK, designers can perform signoff DRC and LVS checking of complete multi-die systems at any process node without breaking current tool flows or requiring new data formats, significantly reducing time to tapeout.