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The six key differentiators of Xpedition Package Designer (xPD)

Reading time: 7 minutes
Image of an IC package representing High-Density Advanced Packaging (HDAP) technologies
Xpedition Package Designer (xPD) is designed for the physical design, verification, and modeling of emerging High-Density Advanced Packaging (HDAP) technologies. Let’s break down six key features that set xPD apart from the competition.

In this eBook we will break down these six key features that set xPD apart from the competition:

  • Dynamic mask-ready hatched metal fill

  • Degassing void control under differential pairs

  • Visual guide for manual void degassing void insertion

  • Graduated multi-pass outgassing

  • Offset hatched planes

  • Predictable PDN stability

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