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Launching The Full Potential Of 3D IC With Front-End Architectural Planning

Reading time: 8 minutes
Drawing of a 3D IC package with multiple layers stacked
3D IC and chiplet-based design have the potential to accelerate the pace of semiconductor industry innovation. 3D IC design teams pack more functionality closer together and achieve higher levels of systems integration and performance in a smaller footprint faster than what’s possible with traditional SoC implementation.
To achieve the full potential of 3D IC, teams need cost-effective front-end design approaches that enable engineers and architects to evaluate the ramifications of different microarchitectures on physical size, power, performance, and cost of production, among other things.
Learn about the deployment of high-level predictive analysis that helps determine optimal architectures for specific cases in this eBook.

Take off with front-end 3D IC design and verification flows

The electronics design automation (EDA) industry is making a bet on 3D IC, in that EDA tools and methodologies can tip the balance toward making it profitable and technologically viable for commercia deployment. Heterogenous package workflows that help teams make architectural trade-off decisions and supports early experimentation and exploration are critical to 3D IC success.

3D IC front-end design planning and predictive analytics

Download this eBook to learn more about 3D IC front-end design planning and predictive analysis.

  • Learn about ways predictive analytics will improve 3D IC design

  • Compare the most cost-effective, front-end 3D IC design approaches

  • Understand the groundwork Siemens EDA is laying to deliver a more efficient, accessible, and profitable 3D IC design process

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