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Implementing DFT in 2.5D/3D designs using Tessent Multi-die

Blue green layered 3D chip
The demand for smaller, higher-performing and more power-efficient integrated circuits (ICs) continues. Next-generation devices increasingly feature complex architectures that connect 3D IC (vertical) or 2.5D (side-by-side) dies so that they behave as a true System-in-Package (SiP). Tessent Multi-die software delivers comprehensive automation for the complex DFT tasks associated with 2.5D and 3D IC designs.

Tessent Multi-die software automates complex 2.5D and 3D IC design-for-test operations

Tessent Multi-die helps customers speed and simplify critical design-for-test (DFT) tasks for next-generation ICs based on 2.5D and 3D architectures. Faster, simpler DFT enables IC design teams to rapidly generate compliant hardware. Tessent Multi-die enables customers to slash test implementation efforts while optimizing manufacturing test costs and accelerating time to market.

The Siemens Tessent Multi-die software automates, streamlines, and accelerates key DFT tasks for next-generation 2.5D and 3D ICs.

Download this eBook to learn more about Siemens Tessent Multi-die DFT

  • Todays 2.5D/3D Multi-chip DFT Challenges

  • Why Implement Tessent DFT in 2.5D/3D Integrations?

  • Tessent Multi-die DFT Capabilities

  • Tessent Multi-die DFT Competitive Advantages

  • Accelerate DFT tasks with Tessent’s Multi-die Solution

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