IC package physical design best practices

Historically IC package design has been a relatively simple task which allowed the die bumps to be fanned out on a package substrate to a floorplan geometry suitable for connecting to a printed circuit board (PCB). But today the industry is moving to disaggregation of traditional monolithic SoC functions into chiplets often interfaced with local high-speed memory to avoid silicon reticle limits and yield challenges. Today’s packages are now complex systems containing high-speed chiplet2chiplet interfaces such as UCIe and BoW along with HBM for the memory all heterogeneously integrated on a high-performance substrate.

IC package design best practices

In order to efficiently design new types of IC packages, designers and design teams need to embrace a new emerging set of best practice design techniques, processes and methodologies that are covered in this eBook:

• Achieving substrate supplier’s fabrication
  requirements
• Shifting-left “big-rock” power delivery analysis
• Adopting efficient integration methodologies
  for HBM memory
• Leveraging concurrent team design
• Utilizing physical design IP reuse
• Designing daisy-chain test vehicles efficiently
• Using datapath planning and routing

Learn more about IC packaging solutions.