Heterogeneous chiplet integration: Navigating interconnect planning and electrical optimization

As the complexity of multi chiplet packages continues to grow, the need for efficient interconnect planning and optimization has become paramount. This eBook guides designers through the process of identifying signal groups, planning their paths, and optimizing electrical performance to ensure seamless integration of chiplets into advanced packaging platforms.

Discover a methodology that enables system-level technology co-optimization (STCO) and empowers design engineers to reduce dependency on experts. By providing best practices for managing heterogeneous data and facilitating communication across teams, this eBook equips designers with the tools needed to achieve optimal power, performance, area, cost, and reliability tradeoffs. With a focus on early insights and continuous verification, designers can streamline the chiplet integration process and eliminate repetitive iterations, leading to improved design quality and efficiency.

The third stage of heterogeneous integration: Interconnect planning and electrical optimization

In this eBook, the third of four in the series, we focus on the third stage in heterogeneous chip integration: scenario completion.

This stage consists of:

• Interface planning
• Predictive analysis driven design optimization

Download the eBook to delve into a methodology that, when paired with advanced design tools, enables system-level technology co-optimization (STCO) for power, performance, area, cost, and reliability across silicon, packages, interposers, and PCBs. Explore strategies for efficient chiplet interface route planning, predictive analysis for CPI trade-off exploration, and early scenario completion to ensure optimal design outcomes.