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Ensuring 3D IC Semiconductor Reliability: Challenges and Solutions for Successful Integration

Reading time: 7 minutes
3D ICs extend heterogeneous advanced package technology into the third dimension. They carry the same design to manufacturability challenges as 2D advanced packages, and then some. Although far from mainstream, their time is coming, as chiplet standardization efforts and supporting tool developments begin to make 3D IC practicable and profitable to more players – big and small – and products with smaller production runs.

Understanding the Benefits of 3D IC Semiconductor Design

There are significant benefits to 3D IC and chiplet-based design

3D IC enables companies to partition a semiconductor design and integrate silicon IP at the most appropriate process node and process, providing low latency, high-bandwidth data movement, lower manufacturing costs, higher wafer yields, lower power consumption and overall lower costs.

Challenges in Ensuring 3D IC Semiconductor Reliability

3D IC integration requires ensuring the reliability of new components

These include:

  • Through-silicon vias (TSV) that connect the front and backside metal stack in the active dies or passive interposers to allow for vertical die stacking

  • Through-compound vias that can connect chiplets vertically through oxide or organic material for large distances

  • Micro bumps for the vertical connection of chiplets at close range

  • Copper pads for hybrid bonding and redistribution layers to connect various 3D IC chips.

Solutions for Reliable 3D IC Semiconductor Design and Integration

Download this eBook as we explore some of the challenges 3D IC assemblies impose when ensuring manufacturability and reliability.