Xpedition Package Designer (xPD)

Xpedition Package Designer supports single- and multi-die/chiplet configurations and a variety of attachment technologies including wire bond, flip-chip, stacked-die, system-in-package (SiP) and package-on-package (PoP). It also supports the latest silicon-based technologies, such as RDL based fan-out wafer level packaging (FOWLP) and 2.5D/3D interposers including embedded and raised silicon bridges without requiring costly product add-ons or upgrades.

Benefits and features

• Supports design of advanced semiconductor packaging such as FOWLP, 2.5D/3D, heterogeneous integration using silicon, glass or organic interposers, embedded or raised substrate bridges, ABF build-up, RDL build-up, system-in-package and modules
• Advanced dynamic metal fill with DFM-ready results including multi-pass degassing, metal balancing and offset hatched planes
• Provides fast predictable design through real-time design visualization and editing in 2D and 3D
  Removes/reduces time-consuming, post-design, signoff-driven ECOs through in-design geometry DRC
• Direct creation of SI/PI 3D simulation models with the integrated Fast 3D field solver
  Fast high quality mask generation using GDSII and OASIS
• Shortest path and cycle time to full mask LVS and package assembly signoff through direct integration with Calibre 3DSTACK

Download the brochure to learn more.