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Interview – Klaus Olesen, Thermal Design Specialist, Danfoss Drives

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Power Electronics Thermal Management
Read the short interview with Klaus Olesen for his take on megatrends and challenges for power electronics cooling and why Danfoss chose Simcenter FloEFD for their IGBT cooling product development.

Klaus Olesen is responsible for developing new cooling technologies for power electronic components and systems which covers thermal, thermo-mechanical and fluid dynamics simulation tools (FEM, CFD), power electronics reliability and lifetime assessment, from concept development to feasibility studies. In this interview, Klaus discusses current trends in thermal design and how to tailor solutions for customers, the evolution of IGBT liquid cooling and the efficiency of Simcenter FLOEFD as a CFD design tool to compress design cycles and achieve accuracy.