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EDA challenges for 3D IC stacking technology

3D IC is consistently evolving and preparing for this emerging alternative to monolithic designs is essential for successful adoption. In this article, Semiconductor Engineering sat down with industry experts to learn more about challenges the changes in design tools and methodologies that are needed for developing 3D IC packaging.

See how experts answer:
  • What considerations are necessary?
  • How does place-and-route, timing closure, power delivery, and thermal impacting designs?
  • How do you approach changing the design flow?
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