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archived webinar

Implementing HBM interfaces with chiplets/SoC’s in advanced IC Packages

Illustration of a chiplet
In this webinar, you will get an introduction to HBM and its challenges, then learn how to develop and optimize a HBM based package floorplan and understand what an optimal workflow looks like for detailed physical implementation including channel characterization. In addition, we'll explore the development of circuit replication blocks and discuss signoff and tapeout.

What you will learn:

  • How to floor plan the chiplet design by creating an HBM and an SoC

  • How to plan and prototype the design before physically laying it out

  • How to create breakout structures

  • How to utilize complex vias

  • How to route HBM channels in XPD

  • How to export the HBM channel to HyperLynx

  • How to address any DRC issues and backward annotate GDS edits if necessary

At the end, you will not only understand what HBM is from a package designers’ viewpoint but also how the Siemens design solution can boost your productivity and achieve your companies design objectives.

Learn more about advanced semiconductor packaging best practices.

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