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Innovator3D IC Protocol Analyzer (i3DPA)

Ensure first‑pass UCIe compliance

Innovator3D IC Protocol Analyzer (i3DPA) screenshot 3D EM modeling

Innovator3D IC Protocol Analyzer (i3DPA) gives chiplet designers a complete, system‑level environment for achieving rapid, reliable UCIe protocol compliance. By integrating channel exploration, compliance verification, 3D breakout modeling, full‑wave EM analysis, and AI‑powered design‑space exploration, it dramatically reduces design risk and accelerates time‑to‑market. Engineers gain pre‑route confidence in feasibility, automate complex compliance workflows, and evaluate interconnect performance across speed grades up to 32 GT/s—long before costly layout and manufacturing steps begin.

What you will learn:

  • How i3DPA delivers integrated pre- and post-layout analysis for rapid UCIe protocol compliance.
  • The essential tools combined in i3DPA, including Channel Explorer and Advanced Package Solvers.
  • How AI-augmented Design Space Exploration optimizes protocol settings and channel performance.
  • i3DPA's capabilities in performing standards-based interconnect Compliance Analysis and IBIS-AMI simulation.
  • Support for UCIe speed grades from 4-32 GT/s and various package types.

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