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Meeting aggressive TTM challenges for AI chips with advanced DFT automation

Εκτιμώμενος χρόνος παρακολούθησης: 13 λεπτά

Broadcom's ASIC division delivers custom silicon products to several AI chip companies in 16 nm and 7 nm technology nodes with significant complexities. Broadcom has developed advanced DFT automation using Tessent that reduces silicon turn-on and ramp to production. This presentation will show Broadcom's journey of transitioning to hierarchical DFT and IJTAG-based IP tests.

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