φυλλάδιο
Innovator3D IC Integrator (i3DI)
Streamline pathfinding, prototyping, and predictive analysis for advanced 2.5D/3D IC architectures.
Χρόνος ανάγνωσης: 7 λεπτά
Innovator3D IC Integrator (i3DI) empowers semiconductor design teams with a comprehensive, AI-driven cockpit that unifies planning, prototyping, and multiphysics evaluation across heterogeneous chiplet-based systems. By leveraging a complete 3D Digital Twin, integrated STCO methodologies, and a flexible open architecture, i3DI enables earlier insights, faster iterations, and dramatically reduced downstream rework. The result is a more predictable, efficient, and collaborative design process: one that helps teams optimize PPA, accelerate development time, and confidently transition from concept to manufacturing.
What you will learn:
- Why an integrated 3D Digital Twin accelerates pathfinding and enhances predictive multiphysics analysis.
- How AI-powered automation improves design productivity, interconnect optimization, and power/ground assignment.
- How System Technology Co‑Optimization (STCO) uncovers issues earlier and reduces costly redesign cycles.
- Ways i3DI supports industry standards like IEEE 3Dblox, UCIe, and OCP CDX for seamless ecosystem interoperability.
- How comprehensive workflows, from architectural planning to signoff, enable a unified and secure design process.