Siemens Bay Area Semiconductor Summit
AI Hardware innovation – From Semiconductor design to AI Datacenter deployment
LIVE EVENT
Wednesday, October 7, 2026 | 10:00 AM–4:00 PM
Siemens Office: 5455 Great America Pkwy, Suite 401, Santa Clara, CA 95054
Room: Levi's Stadium A
Lunch included + Networking Happy Hour to follow
Join Siemens Digital Industries Software for a full-day technical workshop on advanced semiconductor packaging, thermal management, and AI-driven engineering workflows.
As chip complexity and power densities increase, engineering teams face new challenges across design, simulation, validation, and lifecycle management. This event brings together Siemens experts and industry practitioners to demonstrate integrated workflows that accelerate product development while improving thermal performance, reliability, and engineering productivity.
Guest Speaker: Hear from Resonac, a leading supplier of advanced packaging materials and high-capacity storage components that support the AI hardware industry. Gain insights into the materials and technologies shaping the next generation of AI infrastructure.
Who should attend: Thermal Engineers, Package Engineers, Mechanical Engineers, Semiconductor Design Engineers, System Architects, Engineering Managers & Leaders, and R&D teams working on AI infrastructure, HPC, and advanced electronics.
Registration Closed
Bay Area Semiconductor Summit: AI Hardware Innovation has reached capacity.
Thank you for your interest in this event. The Bay Area Semiconductor Summit: AI Hardware Innovation is now at capacity, and registration has been closed.
We appreciate the strong interest from the semiconductor and AI hardware community and look forward to welcoming registered attendees on October 7 in Santa Clara.
For information about future Siemens semiconductor and AI hardware events, please follow Siemens Digital Industries Software and connect with your Siemens representative
Agenda:
10:00–10:05 AM: Welcome
10:05 – 11:00 AM: Advanced Packaging Design and Multiphysics
11:00 – 11:20 AM: Thermal Calibration and Validation
11:20 -11:30 AM: BREAK
11:30 – 12:00 PM: Multiphysics Thermo-Mechanical Analysis
12:00 – 1:00 PM: LUNCH and Networking
1:00 – 1:30 PM: Guest speaker - Resonac
1:30 – 2:00 PM: Managing AI Thermal Challenges from Silicon to Systems to Facilities
2:00 – 2:30 PM: Liquid Network Systems: 1D Multidomain Simulation Workflow
2:30 – 2:45 PM: BREAK
2:45 – 3:15 PM: AI Powered Engineering and Design Exploration
3:15 – 3:35 PM: Data Management for AI & Simulation
3:35 – 4:00 PM: Panel Discussion/Q&A