Driven by the explosion of big data and expanding applications, chip design complexity is increasing. Applications such as high-performance computing (HPC), the Internet of Things (IoT), automotive and 5G mobile communications coupled with advanced process technology nodes, require running a large number of circuit simulations to ensure the circuits function correctly. This means even more simulation runtime and the requirement for more compute resources. On-premises compute capacity has undeniably become a bottleneck. Cloud computing is a viable solution to drastically reduce simulation runtime for circuit simulation workflow. In collaboration with Amazon Web Services (AWS), Siemens EDA has made a cloud-ready Analog FastSPICE (AFS) platform available to accelerate design innovation.