Breaking the bottleneck: Overcoming the Verification Productivity Gap 2.0
AI/IQ-powered smart verification
The semiconductor industry is confronting the Verification Productivity Gap 2.0, characterized by the unique complexities and challenges of the latest semiconductor design technologies. Siemens envisions a transformative solution through connected, data-driven, and scalable verification platforms designed to accelerate processes and optimize resource allocation. By integrating AI-driven technologies, we can automate workflows, derive actionable insights, and significantly enhance precision in identifying and resolving bottlenecks. This approach will address cross-design-domain interdependencies, alleviate workforce strain, and ensure more robust, efficient verification.
Smart verification integrates intelligent capabilities to redefine the boundaries of traditional verification. By harnessing cutting-edge technologies, smart verification aims to revolutionize processes, empowering engineering teams to achieve unprecedented levels of effectiveness. These AI/IQ-powered solutions not only automate and scale verification but also drive insightful data analysis, simplify debugging and enable engineering teams to master complex, software-centric architectures with unparalleled agility.
Breaking the bottleneck of the Verification Productivity Gap 2.0 is not just an operational necessity but a strategic imperative. By defining clear success metrics, implementing a structured roadmap, and maintaining a visionary outlook, the semiconductor industry can overcome current challenges and pave the way for sustained innovation and competitiveness. Advanced automation and AI solutions are essential transformations for accelerating time-to-market and ensuring long-term success.