Accelerate semiconductor lifecycle management with end-to-end digitalization
Streamline new product introductions and reduce fragmentation from design through manufacturing
Siemens semiconductor lifecycle management solution eliminates legacy system fragmentation with end-to-end digitalization across three modules: new product introduction, IC design management and IP reuse, and IC manufacturing planning. This holistic approach accelerates NPIs and connects design to manufacturing through a single digital thread, enabling semiconductor companies to launch products faster while maintaining complete traceability and security.
Streamline semiconductor operations with integrated lifecycle management
Only 45 percent of semiconductor new product introductions meet their launch dates, while over 60 percent of designs require at least one respin. These delays stem from fragmented legacy systems that cannot provide the interoperability needed for today's complex semiconductor ecosystem.
End-to-end digitalization connects design through manufacturing with complete traceability, addressing critical challenges in new product introduction, IC design management and manufacturing planning. Three integrated modules work together to accelerate time-to-market: automated project management with phase gate processes, secure IP library management with design artifact control and manufacturing recipe management with bill-of-materials and bill-of-process capabilities.
The result is faster product launches, improved research and development yields, reduced design cycle times and standardized processes across globally distributed sites. Learn how leading semiconductor companies are transforming their operations with integrated lifecycle management.