Innovator3D IC 2409 Update 3

Innovator 3D IC 2409 Update 3 is a fully compatible release that uses the original 2409 release as its base. Download this fact sheet to learn more about the new features in this release.

Features included in this software update

• Full support for a dedicated interposer object with die/chiplet UBM pad array creation, mapping and array scaling/compensation with bidirectional integration with Xpedition Package Designer (xPD)
• Automatic creation of an xPD design on first snapshot import
• Launch xPD from inside Innovator3D IC (i3D) and have it open on the current design
• Support for layer stack up integration with xPD
• Ability to track internal device connectivity based on pin properties.