E-Book
Implementing DFT in 2.5D/3D designs using Tessent Multi-die
Tessent Multi-die software automates complex 2.5D and 3D IC design-for-test operations
Tessent Multi-die helps customers speed and simplify critical design-for-test (DFT) tasks for next-generation ICs based on 2.5D and 3D architectures. Faster, simpler DFT enables IC design teams to rapidly generate compliant hardware. Tessent Multi-die enables customers to slash test implementation efforts while optimizing manufacturing test costs and accelerating time to market.
The Siemens Tessent Multi-die software automates, streamlines, and accelerates key DFT tasks for next-generation 2.5D and 3D ICs.
Download this eBook to learn more about Siemens Tessent Multi-die DFT
Todays 2.5D/3D Multi-chip DFT Challenges
Why Implement Tessent DFT in 2.5D/3D Integrations?
Tessent Multi-die DFT Capabilities
Tessent Multi-die DFT Competitive Advantages
Accelerate DFT tasks with Tessent’s Multi-die Solution