Schnellere und präzisere Angebotserstellung für unabhängige Elektronikhersteller (3)
The semiconductor industry stands at a pivotal moment in its evolution, where traditional scaling methods are reaching their physical and economic limits. This comprehensive eBook addresses a crucial time when the industry is actively seeking new solutions to maintain the pace of innovation and meet the ever-increasing demands of modern computing applications. The transition to 3D IC design represents not just a technological advancement, but a fundamental shift in how we approach semiconductor design and integration.
As we navigate this transformation, it becomes increasingly clear that success requires more than just technical knowledge — it demands a complete reimagining of our design methodologies and collaboration models. This eBook aims to bridge the gap between current practices and future requirements, offering practical insights and strategic guidance for organizations embarking on their 3D IC journey. By combining technical depth with real-world implementation strategies, it provides a roadmap for both engineering teams and decision-makers.
Download this eBook to gain expert insights from the 2025 Siemens EDA 3D IC podcast episode featuring Kevin Reinbold 3D IC Packaging and Account Technology Manager at Siemens EDA. In his customer-facing role, Kevin serves as a crucial bridge between emerging customer needs and technological solutions, helping shape the future of semiconductor packaging. His unique position at the intersection of customer requirements and technological capabilities make him an authoritative voice in the industry’s transition to 3D IC integration.
Key insights discussed
- The current state of 3D IC integration
- Understanding true 3D vs 2.5D integration
- The economic drivers of 3D IC adoption
- Technical drivers and tipping points
- Future outlook: Methodology and mindset changes