E-Book

Schnellere und präzisere Angebotserstellung für unabhängige Elektronikhersteller (1)

Zwei Ingenieure in der Elektronikfertigung diskutieren über die automatisierte Angebotserstellung mithilfe des BOM Connectors

How do you design and verify a package with tens of millions of pins without losing months to manual rework? The semiconductor industry stands at a pivotal juncture, experiencing a fundamental shift towards 3D IC technology. This evolution is not merely an option but a critical necessity for the future of electronic systems, driven by the escalating complexity and the imperative for cost-effective, high-performance solutions.

Download this eBook to gain expert insights from the 2025 Siemens EDA 3D IC podcast episode featuring Per Viklund, Director of IC Packaging and RF Product Lines at Siemens EDA. It delves into the challenges posed by this new era of chiplet integration and

advanced packaging. It also highlights how innovative methodologies, particularly hierarchical device planning, are indispensable for managing the explosion in design complexity, mitigating significant risks, and ensuring the successful realization of next-generation electronic systems.

Key insights discussed

  • The current state of 3D IC integration
  • Understanding true 3D vs 2.5D integration
  • The economic drivers of 3D IC adoption
  • Technical drivers and tipping points
  • Future outlook: Methodology and mindset changes

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