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3D IC Podcast episode 13 insights: Why 3D ICs need a mindset shift - And how to make it happen

Deliver 3D IC innovations faster

Unlocking the power of system-level planning in 3D IC integration

What does it take to turn 3D IC from a buzzword into a successful reality, and how early should you start thinking about system-level planning? Lean in as we unpack the common pitfalls of treating chip package design in isolation from system goals, and how the shift from chip-centric to system-centric thinking can redefine success in high-density, high-performance integration.

Download this ebook to gain expert insights from the 2025 Siemens EDA 3D IC podcast episode featuring Tony Mastroianni, Siemens EDA Advanced Packaging Solutions Director, from the 3D IC podcast series hosted by John McMillan. The podcast explores the evolution of semiconductor technology, with a particular focus on 3D IC design, chiplet integration, and the cultural and technical challenges of implementing these advanced technologies. We also discuss the critical role of co-design, early simulation, and cross-disciplinary collaboration to reduce iterations, control cost, and accelerate time to market.

Key insights discussed

  • The current state of 3D IC integration
  • Understanding true 3D vs 2.5D integration
  • The economic drivers of 3D IC adoption
  • Technical drivers and tipping points
  • Future outlook: Methodology and mindset changes

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