technický dokument
An organic package designer's guide to transitioning to FOWLP and 2.5D design
Doba čtení: 7 min.
This paper shares insights based on the experiences of organic package substrate designers who have transitioned and mastered RDL-based FOWLP and 2.5D silicon and organic interposer design, while still using (and preserving) the majority of their existing packaged design tools and skills.