Impacts of 3D IC on the future: Delivering 3D IC innovations faster

Developers of high-end semiconductor products that face manufacturing limitations with respect to die sizes are investing in 3D stacked die technology. These advanced designs already push current design-for-test (DFT) solutions to the limits: tool run time, on-chip area demand, test pattern count, and test time.

The next major step for improving system-in-package technology is 3D die stacking and packaging.

While there are multiple methods of 3D die stacking, they share the common goal of using smaller, high-yield dies that are vertically stacked. This strategy can alleviate many of the test challenges for large 2D or 2.5D devices.

This comprehensive eBook guides you through the insights and resources you need to learn more about the impacts of 3D IC on the future including:

• How to deliver 3D IC innovations faster when preparing for 3D ICs
• How to build confidence and flexibility in 3D IC system level design
• Strategies for affordable and comprehensive design for test of 3D stacked die devices
• Where to listen in as 3D IC Industry experts discuss the latest 3D IC concepts and trends
• What 5 key workflows are needed for 3D IC packaging success